Hermetically sealed packages are utilized by manufacturers of hybrid microelectronic assemblies, opto-electronic devices and imaging devices to protect their sensitive circuits. HCC Industries packaging companies, HCC Aegis Inc (known in the industry simply as Aegis), Glasseal Products, Inc and General Ceramics are experts in the design and manufacture of glass-to-metal-sealed and high temperature co-fired ceramic packages to meet the demands of these devices. Our experience and expertise includes sealing many different alloys, the effective utilization of thermal management materials (heat sinks) to dissipate heat, complex geometries, tight tolerances and demanding test requirements commonly called out in these industries.
HCC has over 25-years of experience in the design, development and manufacture of micro-electronic hermetic packages and has made thousands of different designs.
The product types within our Microelectronic product line include:
- High Temperature Cofired Ceramics (HTCC)
- Flatpacks
- Metal Platforms
- Plug-Ins
- Transistor Outlines
- Power Surface Mounts
- Windows, Lids, and Covers
- CNC Machined Housings
Download Hybrid microelectronic packages and TO Headers data sheet from Glasseal Products here
Download data on Machined Electro-optical and micro-electronic packages from Glasseal Products
Download data on machined Aluminum Microelectronic packages from HCC Aegis
