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AL, FL, GA, MS, NC, SC & TN
Teledyne Microelectronics in Los Angeles, California is a full service microelectronics contract manufacturer offering innovative approaches in packaging and testing of microcircuits, multichip modules and multichip assemblies for military, aerospace, optoelectronics, test/measurement and medical markets. In our DOD cleared facility, we specialize in high density microminiature devices utilizing the latest advanced packaging techniques. Areas of expertise include RF/microwave, optoelectronics, military secure communications and analog/digital. We are certified to IS09001:2000, MIL-PRF-38534 Class “H” and “K” and received accreditation by the DOD/DMEA as a Microelectronics Trusted Source for Packaging, Assembly and Test. We are committed to bringing reliability, precision, performance and innovation to every packaging project.
 Visit entire line of Teledyne Microelectronics Techonologies
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